TGL2217-SM
0.1 - 20 GHz, 10 Watt VPIN Limiter
Key Features
- Frequency range: 0.1 to 20.0 GHz
- Insertion loss: < 0.9 dB
- Power handling: 10 W (pulsed)
- Flat leakage: < 18.5 dBm
- Spike leakage: < 20.5 dBm
- Recovery time: < 115 ns
- Passive (no DC bias required)
- Package dimensions: 3.50 x 3.50 x 1.64 mm
| Mouser | 4405 | Buy Online > | |
| RELL | 0 | Buy Online > | |
| RFMW | 549 | Buy Online > |
Qorvo's TGL2217-SM is a packaged high power, wideband GaAs VPIN limiter capable of protecting sensitive receive channel components against high power incident signals. The TGL2217-SM does not require DC bias and achieves a low insertion loss all in a small form factor. These features allow for simple integration with minimal impact to system performance.
The TGL2217-SM operates from 0.1–20.0 GHz with low insertion loss of less than 0.9 dB. Receive protection is rated up to 10 W incident pulsed-power with a low flat leakage of less than 18.5 dBm.
The TGL2217-SM is offered in a small 3.5 x 3.5 mm QFN package for simple board level assembly. Fully matched to 50 ohms on both RF ports, it is well suited for both commercial and defense related applications.
Lead-free and RoHS compliant.
Evaluation boards available on request.
Typical Applications
- Commercial Radar
- Military Radar
- Receive Chain Protection
- EW Digital Receiver
Application Categories
| Frequency Min(GHz) | 0.1 |
| Frequency Max(GHz) | 20 |
| Insertion Loss(dB) | < 0.9 |
| Flat Leakage(dBm) | < 18.5 |
| Package Type | QFN |
| Package(mm) | 3.5 x 3.5 x 1.64 |
| RoHS | Yes |
| Lead Free | Yes |
| Halogen Free | Yes |
| ITAR Restricted | No |
| ECCN | EAR99 |
X-Microwave Design System
This product is available as an X-Microwave Block (X-MWblock) for evaluation.
X-MWblocks are RF and microwave "drop-in" components that can be used individually for prototyping or in production assemblies. X-MWblocks are easy to test, integrate, align, and configure to 60 GHz and beyond. No messy sweat soldering or silver epoxy processes are required. X-MWblocks are highly characterized with S-parameter models and connect with a patented solder-less interconnect technology.
This product appears in the following application block diagrams: