Our Technologies

For three decades we have pioneered and honed many industry-leading processes:

Gallium nitride (GaN)
Gallium arsenide (GaAs)
Bulk acoustic wave (BAW)
Surface acoustic wave (SAW)

GaN on silicon carbide (SiC)
GaN on diamond
CuFlip™ flip-chip interconnect techniques
Wafer level packaging (WLP)

Innovating new technologies solves our customers' toughest RF challenges. Qorvo engineers work in the future, driving industry advancements and developing next-generation technology. We then hone those processes and bring them to the commercial market, helping our customers boost product performance, lower costs and roll out new technologies faster.

Qorvo was founded on RF innovation — and our advanced technology sets new benchmarks today. By continually innovating and improving our technology, Qorvo earns its reputation as the RF provider of choice for manufacturers worldwide. See what we're working on here.

• Advanced Packaging

  Qorvo's global design, manufacturing, assembly, qualification and packaging facilities provide quality for our defense, mobile and RF communications customers around the world.

• Bulk Acoustic Wave (BAW)

  Qorvo's bulk acoustic wave technology solves the toughest RF interference challenges.

• Gallium Nitride (GaN)

  Qorvo's industry-leading gallium nitride powers technology that keeps you connected and protected.

• RF Integration

  Qorvo's highly integrated RF solutions provide the Optimum Technology Match™ for next-generation smartphones, networks, smart homes and other wireless devices.