QPA5263A
DC - 4500 MHz Cascadable SiGe HBT Amplifier
End of Life announced May 31, 2023 (PCN 23-0087).
Last Time Buy: December 12, 2023
Recommended replacement for new designs: TQP369181
Contact your local sales representative for assistance.
Key Features
- Single Positive Voltage Supply
- Gain: 12.5 dB at 1950 MHz
- Output IP3: +30.5 dBm typical at 1950 MHz
- Noise Figure: 4.4 dB Typical at 1950 MHz
- Lead-free/RoHS-compliant SOT-363 Package
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The QPA5263A is a high performance SiGe HBT MMIC amplifier. A Darlington configuration provides high FT and excellent thermal performance. The heterojunction increases breakdown voltage and minimizes leakage current between junctions. Cancellation of emitter junction non-linearities results in higher suppression of intermodulation products.
The QPA5263A may be operated from a variety of supply voltages by using a voltage dropping resistor. Two DCblocking capacitors, bypass capacitors and an optional RF choke complete the circuit required for operation of this internally matched 50 ohm device.
The QPA5263A is assembled in an industry standard SOT- 363 package that is lead-free and RoHS-compliant.
Typical Applications
- Cellular, PCS, GSM, UMTS
- PA Driver Amplifier
- IF/RF Buffer Amplifier
- Wireless Data, Satellite
Product Categories
Application Categories
| Frequency Min(MHz) | DC |
| Frequency Max(MHz) | 4,500 |
| Gain(dB) | 12.5 |
| OIP3(dBm) | 30.5 |
| NF(dB) | 4.4 |
| Voltage(V) | 6 |
| Current(mA) | 60 |
| Package Type | SOT-363 |
| RoHS | Yes |
| Lead Free | Yes |
| Halogen Free | Yes |
| ITAR Restricted | No |
X-Microwave Design System
This product is available as an X-Microwave Block (X-MWblock) for evaluation.
X-MWblocks are RF and microwave "drop-in" components that can be used individually for prototyping or in production assemblies. X-MWblocks are easy to test, integrate, align, and configure to 60 GHz and beyond. No messy sweat soldering or silver epoxy processes are required. X-MWblocks are highly characterized with S-parameter models and connect with a patented solder-less interconnect technology.
This product appears in the following application block diagrams: