CMD203C4
DC-20 GHz (L, S, C, X, Ku, K Band) SP4T Non-reflective Switch MMIC
Key Features
- High isolation
- Integrated 2:4 TTL decoder
- Low loss broadband performance
- Non-reflective design
- Pb-free RoHS compliant 4x4 mm SMT package
- Positive gain slope
| Mouser | 14 | Buy Online > | |
| RELL | 62 | Buy Online > | |
| RFMW | 78 | Buy Online > |
Qorvo's CMD203C4 is a broadband RF / Microwave MMIC SP4T switch housed in a leadless 4x4 mm surface mount (SMT) package. The CMD203C4 covers DC to 20 GHz and offers a low insertion loss of 2.4 dB and high isolation of 39 dB at 10 GHz. The switch also includes an on-board binary decoder circuit which reduces the number of required logic control lines from four to two. The CMD203C4 switch MMIC operates using complementary control voltage logic lines of 0/-5 V and consumes little DC current.
Typical Applications
- Electronic Warfare (EW)
- Radar
- Space
- Satellite Communications (Satcom)
- Test & Measurement
Product Categories
| Switch Type | SP4T |
| Absorptive/Reflective | Absorptive |
| Frequency Min(MHz) | DC |
| Frequency Max(MHz) | 20,000 |
| Insertion Loss(dB) | 2.4 |
| Isolation(dB) | 39 |
| Switching Speed(ns) | 66 |
| IP0.1dB(dBm) | 14 |
| IP1dB(dBm) | 21 |
| Control Lines(#) | 2 |
| Voltage(V) | 0, -5 |
| Package Type | Ceramic QFN |
| Package(mm) | 4.0 x 4.0 |
| RoHS | Yes |
| Lead Free | Yes |
| ITAR Restricted | No |
| ECCN | EAR99 |
Keysight Model Library
This product is included in our Keysight PathWave System Design (SystemVue) and PathWave RF Synthesis (Genesys) compatible component libraries.
X-Microwave Design System
This product is available as an X-Microwave Block (X-MWblock) for evaluation.
X-MWblocks are RF and microwave "drop-in" components that can be used individually for prototyping or in production assemblies. X-MWblocks are easy to test, integrate, align, and configure to 60 GHz and beyond. No messy sweat soldering or silver epoxy processes are required. X-MWblocks are highly characterized with S-parameter models and connect with a patented solder-less interconnect technology.