AWMF-0218

    37 - 43.5 GHz IF Up/Down Converter

    Key Features

    • 37 to 43.5 GHz operation
    • n260 and n259 3GPP bands
    • Flat wideband IF and RF response
    • Integrated Tx/Rx half duplex switch
    • Industry leading spectral purity
    • Fully integrated sideband and image rejection
    • Active Tx/Rx conversion gain
    • Autonomous temperature telemetry and rejection
    • On-chip x4 LO frequency multiplier
    • High Rx linearity
    • FC-CSP package

    Qorvo's AWMF-0218 is a highly integrated silicon frequency-conversion IC intended for 5G phased array applications. When used together with our beamformer IC products, this device enables low-cost, high-performance, and feature-rich 5G phased array systems. The half-duplex IC integrates Tx single-sideband up-conversion and Rx image-reject down-conversion functionality. An on-chip frequency multiplier simplifies board-level integration with external PLLs.

    The IF up/down converter ICs are fully compatible with the respective beamformer ICs, sharing common mechanical and electrical interfaces, and designed for cascade integration from IF to antenna and back.

    Consider AWMF-0236 Dual Polarization Quad 4x2 Beamformer IC for a full RF solution.

    Typical Applications

      • 3GPP compliant 5G communications arrays and satcom transceivers
    Function Single channel IF up/down converter
    RF Min(GHz) 37
    RF Max(GHz) 43.5
    Package Type FCCSP
    RoHS Yes
    Lead Free Yes
    ITAR Restricted No
    ECCN 5A991.f

    AWMF-0218 Developer Kit

    AWMF-0218 Developer Kit

    Qorvo's AWMF-0218-DK or AWMF-0218-DL developer kits include all hardware and software required to interface to the AWMF-0218. The kits enable full evaluation and RF testing of the converter IC with user-friendly interfaces, including off chip baluns to present a single ended IF input and output. The test board has been carefully designed to demonstrate the performance of the device and to provide the necessary port to port isolation.

    Calibration data is included to enable the removal of test board line losses. The SPI control is supported through a high-speed cable, interposer board, and USB interface module. Driver software and GUI are supplied to provide control from a PC.

    DC power is supplied to the test board through a separate cable assembly also included in the kit. A full set of measured data is included to provide reference performance for each Developer Kit.

    Evaluation of the AWMF-0218 with the Developer Kits will significantly shorten the time to become familiar with the operation and performance of the product, thereby reducing system development time and cost.