Qorvo® Unveils Family of Complete Front End Transmit/Receive Modules Delivering Up to 10 Watts of Saturated Power for X-band Applications

Heterogenous GaN and GaAs multi-chip modules deliver up to three times greater power

GREENSBORO, NC – December 7, 2020 – Qorvo^® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, today introduced the industry’s first fully integrated T/R Front-End Module (FEM) family capable of delivering up to 10 Watts of saturated RF transmit power in a small, 7 mm x 5 mm land grid array (LGA) package. Using Qorvo’s patented heterogeneous packaging techniques, this new FEM product family delivers the power density, reliability and reduced size needed for next-generation X-band radar and surveillance platforms.

The flagship product, QPF5010, can generate 10 watts of power, which is three times greater than the closest competitive solution, while operating between 8-12 GHz (X-band) and delivers an industry-best Power Added Efficiency (PAE) of 30-40%. It achieves this by using best-in-class GaN and GaAs solutions for the four functional blocks, including the T/R switch, power amplifier, low-noise amplifier and limiter. Qorvo also offers pin-compatible 5-watt (QPF5005) and 2-watt (QPF5002) solutions as part of the product family.

The QPF5010 provides engineers with a high performance FEM in a compact size to make design, layout, assembly and test easier to achieve, allowing for shorter design cycles and faster time to market. With three different power ratings (10W, 5W, 2W) in the same package configuration, the family delivers flexibility for more advanced designs, eliminating the need to create new and unique layouts for each power rating.

The integrated Surface Mount Technology (SMT) design also dramatically improves overall reliability and extends Mean Time Between Failures (MTBF) by eliminating many of the potential failure points inherent with discrete PCB alternatives. Procurement and supply chain challenges are reduced due to a smaller bill of materials (BOM). The heterogenous multi-chip module (MCM) packaging capability can be extended to other frequency bands and applications as needed.

Roger Hall, general manager of Qorvo's High Performance Solutions (HPS) business, said,"“The QPF5010 is the culmination of years of listening to what our customers need, and strong collaboration between our design engineering, manufacturing and materials engineering teams to deliver. We are committed to advancing the state of the art in RF technology for decades to come."

The QPF5010, QPF5005 and QPF5002, with the following specifications, are available for sampling to qualified customers.

Qorvo offers the industry’s largest, most innovative GaN-on-SiC portfolio to help customers realize superior efficiency and operational bandwidth. The company’s GaN-on-SiC products deliver high power density, reduced size, excellent gain, high reliability and process maturity. Qorvo is a leading supplier of RF products and compound semiconductor foundry services to defense primes and other global defense and aerospace customers. Qorvo is the only supplier to achieve a Manufacturing Readiness Level 10 (MRL 10) rating from the U.S. Department of Defense.

About Qorvo
Qorvo (Nasdaq: QRVO) makes a better world possible by providing innovative Radio Frequency (RF) solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including advanced wireless devices, wired and wireless networks and defense radar and communications. We also leverage unique competitive strengths to advance 5G networks, cloud computing, the Internet of Things, and other emerging applications that expand the global framework interconnecting people, places and things. Visit www.qorvo.com to learn how Qorvo connects the world.

Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries. All other trademarks are the property of their respective owners.

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